Thermal and thermo‐mechanical modelling of polymer overmoulded electronics

Thermal And Thermo-Mechanical Modelling of Polymer Overmoulded Electronics

This paper reports on the results from a research project investigating a novel technology for the manufacture of recyclable polymeric modules with embedded electronic controls and power distribution. The aim of this project is to develop a technology that fully encapsulates electronics for use in the demanding automotive environment. A two shot moulding technology will protect delicate electro...

Dynamic Thermal Simulation and Modelling of Micro- and Nano-Electronics

As semiconductor devices continuously get both smaller and faster, a profound analysis of the dynamic (time-dependent) thermal behaviour is becoming more and more important. In this article some basic concepts and numerical methods for thermal characterization in the frequency domain are explained. Two practical examples are given. First a simple model is presented for a small package mounted o...

Metallurgical Modelling of Thermomechanical Processing

A Polymer-based Thermal Energy Storage Composite for Temperature Control of Sensors and Electronics

A novel lamination that consists of aluminum heat spreader plates interspersed with a polymer-based thermal energy storage composite is described. The composite consists of a thermoplastic matrix that encapsulates paraffin such that it is immobilized when in the liquid phase. As a consequence, the thermal energy storage/release process is independent of g-loading or orientation. Composites with...

A piezo-thermal probe for thermomechanical analysis.

Thermomechanical analysis (TMA) is widely used to characterize materials and determine transition temperatures and thermal expansion coefficients. Atomic-force microscopy (AFM) microcantilevers have been used for TMA. We have developed a micromachined probe that includes two embedded sensors: one for measuring the mechanical movement of the probe (deflection) and another for providing localized...